A review: properties of silicon carbide materials in MEMS application

Marsi, Noraini and Majlis, Burhanuddin Yeop and Mohd Yasin, Faisal and Zainal Abidin, Hafzaliza Erny and Hamzah, Azrul Azlan (2020) A review: properties of silicon carbide materials in MEMS application. International Journal of Nanoelectronics and Materials, 13 (NIL). pp. 113-128. ISSN 1985-5762

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The paper presents the review properties of silicon carbide materials in the MEMS application. The study aims to explore silicon carbide in MEMS technology which considers the development of microscale and integrated devices that combine electronics, electrical and mechanical elements. MEMS has become a key area micro-device technology which incorporates materials, mechanical, electrical, chemical and optical disciplines as well as fluid engineering. The prevalence of MEMS technology in harsh environments has grown tremendously in recent years, especially at high temperatures up to 1240 ̊C, wider bandgap (2.3 – 3.4 eV), a higher breakdown field (30 × 105 V/cm), a higher thermal conductivity (3.2 – 4.9 W/cm- K), a higher saturation velocity (2.5 × 107 cm/s), higher oxidation, corrosive environments and higher radiation. Recent developments in robust MEMS for extreme environments such as MEMS pressure sensors have been widely used in ships, warships, gas turbine engines, cars and biomedical equipment. The growing demand for MEMS pressure sensors with high-temperature operating capabilities, mainly for automotive, gas turbine engine and aerospace applications was investigated from this study as alternative silicon carbide to silicon in the fabrication of these devices.

Item Type: Article
Uncontrolled Keywords: MEMS; Silicon carbide; High temperature; Radiation; Sensor.
Subjects: T Technology > TP Chemical technology > TP250-261 Industrial electrochemistry
Divisions: Faculty of Engineering Technology > Department of Mechnical Engineering Technology
Depositing User: Miss Nur Rasyidah Rosli
Date Deposited: 30 Jan 2022 03:19
Last Modified: 30 Jan 2022 03:19
URI: http://eprints.uthm.edu.my/id/eprint/6333

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