Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish

Mohamed Anuar, Rabiatul Adawiyah (2017) Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish. Masters thesis, Universiti Tun Hussein Onn Malaysia.

[img] Text
24p RABIATUL ADAWIYAH MOHAMED ANUAR.pdf

Download (16MB)
[img] Text (Copyright Declaration)
RABIATUL ADAWIYAH MOHAMED ANUAR COPYRIGHT DECLARATION.pdf
Restricted to Repository staff only

Download (16MB) | Request a copy
[img] Text (Full Text)
RABIATUL ADAWIYAH MOHAMED ANUAR WATERMARK.pdf
Restricted to Registered users only

Download (16MB) | Request a copy

Abstract

The different surface finish and solder size on printed circuit board strongly affect the formation of intermetallic compounds (IMCs) and solder joint reliability. Among of various surface finish in the electronic industry, electroless nickel/immersion gold is the most popular at the moment. However, because their black pad issues, electroless nickel/immersion silver (ENImAg) was developed as an alternative surface finish. Therefore, the effect on an interfacial reaction between lead-free solder and ENImAg surface finish using different solder ball size (Ø300μm, Ø500μm and Ø700μm) was investigated. All samples were subjected to an aging process with different aging times. The characterizations of IMC formation were examined by image analyzer, scanning electron microscopy and energy dispersive x-ray. The results showed that ENImAg finish was free from the black pad nickel. Subsequently, the solder ball size has a significant effect on the IMC formation and fracture surface of as-reflowed and aged solder joint. The IMC thickness of larger solder balls was found to be thicker (1.74 μm) than smaller solder balls (1.32 μm) during soldering. In contrast to aged solder joints, the smaller solder ball produced thicker (3.51 μm) IMC compared to bigger solder balls (2.47 μm). Furthermore, the fracture surface of smaller solder ball size showed ductile mode for both reflowed and aged solder joints. In addition, the solder joint on ENImAg surface finish displayed a thinner layer and smaller grain sizes compared to solder joint on bare copper.

Item Type: Thesis (Masters)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Mechanical and Manufacturing Engineering > Department of Mechanical Engineering
Depositing User: Mrs. Sabarina Che Mat
Date Deposited: 06 Sep 2021 05:39
Last Modified: 06 Sep 2021 05:39
URI: http://eprints.uthm.edu.my/id/eprint/853

Actions (login required)

View Item View Item