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Comparison between SAC405 lead-free solders and EN(P)EPIG and EN(B)EPIG surface finishes

Osman, Saliza Azlina and Ourdjini, Ali and Ibrahim, Mohd Halim Irwan and Yusof, Mohd Sallehuddin (2014) Comparison between SAC405 lead-free solders and EN(P)EPIG and EN(B)EPIG surface finishes. In: International Integrated Engineering Summit (IIES 2014), 1-4 December 2014, Universiti Tun Hussein Onn Malaysia, Johor.

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Abstract

In electronics industries, most of them had to shifted their solder materials from leaded solders into lead-free solders due to the environmental concerns and follow the legislation of Restriction of use Hazardous Substances (RoHS). Thus, Sn-Ag-Cu solder is one of the choices that can replace the leaded solder and also offer better properties. This study investigates the comparison between Sn-4.0Ag-0.5Cu (SAC405) and EN(P)EPIG and EN(B)EPIG surface finishes. Reliability of solder joint has been assessed by performing solid state isothermal aging at 150ºC for 250 up to 2000 hours. After reflow soldering process, (Cu,Ni)6Sn5 intermetallic compound (IMC) is dominated at near centre of solder meanwhile (Ni,Cu)3Sn4 IMC is dominated at near outside of solder ball. Moreover, aging time resulted in an increase in thickness and changed the morphology into more spherical, dense and large grain size. Analysis by optical microscope revealed that the IMC thickness of EN(B)EPIG produced thicker IMC compared to EN(P)EPIG surface finish during reflow as well as isothermal aging

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: soldering; lead-free solder; intermetallic compounds; isothermal aging; surface finish
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Mechanical and Manufacturing Engineering > Department of Manufacturing and Industrial Engineering
Depositing User: Mrs. Nurhayati Ali
Date Deposited: 09 Mar 2015 06:57
Last Modified: 26 May 2015 08:48
URI: http://eprints.uthm.edu.my/id/eprint/6378
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