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Stress distribution between bonding surface of dental filling in enamel and dentine

Soliheen, M. A. M. and Kurniawan, D. and M.Nor, Fethma (2015) Stress distribution between bonding surface of dental filling in enamel and dentine. In: 2nd International Materials, Industrial & Manufacturing Engineering Conference (MIMEC 2015), 4-6 February 2015, Bali Nusa Dua Convention Center, Bali, Indonesia.

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Abstract

Dental decay (or caries) is common disease worldwide. It is caused by acid which first dissolves enamel and afterwards dentine, causing pain when stimulated. Decay occurs most often in the fissures on the top of the teeth or in between the teeth. A solution for this is by having dental filling. This paper investigates the stress distribution between bonding surface of dental filling in enamel and dentine. Finite element analysis was used to perform the numerical analysis on an arbitrarily shaped dental filling inserted on a teeth loaded by a pressure. Dental amalgam and ceramic (porcelain) were taken as the materials of interest. It was found that the dental made of conventional ceramic may not able to withstand heavy pressure from crunching and chewing the way amalgam fillings can, and they may not last as long

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: finite element; dental filling; enamel; dentine; amalgam; ceramic
Subjects: R Medicine > RK Dentistry
Divisions: Faculty of Mechanical and Manufacturing Engineering > Department of Mechanical Engineering Technology
Depositing User: Mrs. Nurhayati Ali
Date Deposited: 08 Jun 2015 08:49
Last Modified: 08 Jun 2015 08:49
URI: http://eprints.uthm.edu.my/id/eprint/6835
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