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The development of new backside decapsualtion technique to investigate integrated circuit failure in the automotive application environment

Tuan Ahmad, Tuan Mohd Mustaqim (2015) The development of new backside decapsualtion technique to investigate integrated circuit failure in the automotive application environment. Masters thesis, Universiti Tun Hussein Onn Malaysia.

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Abstract

The semiconductor industry is the aggregate collection of companies engaged in the design and fabrication of semiconductor devices. To establish the good company of semiconductor, the development of failure analysis organization must be made. Failure analysis is the process of collecting and analyzing data to determine the cause of a failure. It is an important discipline in many branches of manufacturing industry, such as the electronics industry, where it is a vital tool used in the development of new products and for the improvement of existing products. The failure analysis process relies on collecting failed components for subsequent examination of the cause or causes of failure using a wide array of methods, especially microscopy and spectroscopy. This project will discuss about the failure analysis step and procedure. The aim of this project is to design a new backside decapsulation method in order to improve the failure analysis processing time and root cause finding. This project contains of several parts which are electrical analysis, IC decapsulation with chemical analysis and fault isolation step. Comparison between the old method and new method result has been made and the effectiveness of the sample has been measured by performing analysis on 20 samples. The simulation and measurement results show 85.5% of improvement in term of failure analysis processing time by comparing with old method. In term of root cause identification, the root cause has been successfully identify for all samples which were related to EOS, ESD and Wafer Fabrication related failure classified as Poly and GOX. Based on this result, the success rate for 20 samples by using new backside decapsulation technique is 100%.

Item Type: Thesis (Masters)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Depositing User: Normajihan Abd. Rahman
Date Deposited: 06 Mar 2016 09:21
Last Modified: 06 Mar 2016 09:21
URI: http://eprints.uthm.edu.my/id/eprint/7577
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