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Intermetallic compound formation on lead-free solder by using microwave energy

Osman, Saliza Azlina and Tajul Baharuddin, Mohamad Faizal Intermetallic compound formation on lead-free solder by using microwave energy. In: International Conference On Advanced Science, Engineering and Technology (ICASET), 21-22 December 2015, Penang, Malaysia. (Unpublished)

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Abstract

Soldering lead-!?ee solders and copper substrate using microwave heating has been technicallv challen-ei ne-. due to reflection of microwaves. This reflection effect is the biggest issue that need to be considered in order to get successful joint between solderlpad interfaces. This study investigates the intermetallics formation on ~ ~ ~le4ad-f0ree5 sol ders and ioo.o.e r o. ad bv, usine microwave - energy. Graphite and iron powder was used as susceptor material to facilitate microwave heating.. Different amount of susceotor were used to comoare its ciicct 12 [he svldrr join1 nilcrostructure. nonding lo idrm [he solder jolnu was nindc by domeslic nilcrowa\,e oven with opcraling frey~~sncoyf 2:15(ill/ and SOON' for XO scconds. Clnr~:icri,.fition of rn;llcri;~lr ras conduc~cd illro-~ rh optical microscope (OM), Image Analyzer and Field Emission Scanning Electron Machine (FESEM). The results revealed that just after soldering process, only Cu6Sn5 intermetallic compound (IMC) is formed between solder and copper pad. By using optical microscope, the average thickness of the intermetallics was measured and it was found that the high amount of susceptor produced thicker IMC than the small amount of susceptor during microwave soldering

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: lead-free solder; wave soldering; intermetallic compound; solder joint
Subjects: T Technology > T Technology (General)
Divisions: Faculty of Mechanical and Manufacturing Engineering > Department of Manufacturing and Industrial Engineering
Depositing User: Mrs. Nurhayati Ali
Date Deposited: 13 Aug 2018 03:39
Last Modified: 13 Aug 2018 03:39
URI: http://eprints.uthm.edu.my/id/eprint/8292
Statistic Details: View Download Statistic

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