Items where Author is "Wei, Chuan Khang"
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M. A., Azmah Hanim and N., Muhamad Kamil and Wei, Chuan Khang and T. T., Dele‑Afolabi and O., Saliza Azlina (2020) Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish. Journal of Materials Science: Materials in Electronics, 31. pp. 8316-8328. ISSN 0957-4522