Items where Author is "O., Saliza Azlina"

Article

Dele-Afolabi, T. T. and M. A., Azmah Hanim and K., Vidyatharran and K. A., Matori and O., Saliza Azlina and R., Calin (2022) Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. Journal of Materials Science: Materials in Electronics volume, 33. ISSN 8233–8246

M.A., Rabiatul Adawiyah and S.A., Amirul and O., Saliza Azlina and H., Syafiq (2020) Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate. Materialwissenschaft und Werkstofftechnik, 51 (6). pp. 780-786. ISSN 0933-5137

M. A., Azmah Hanim and N., Muhamad Kamil and Wei, Chuan Khang and T. T., Dele‑Afolabi and O., Saliza Azlina (2020) Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish. Journal of Materials Science: Materials in Electronics, 31. pp. 8316-8328. ISSN 0957-4522

M.A., Rabiatul Adawiyah and A.B., M. Hafiz and O., Saliza Azlina and J., Zolhafizi and W.M., Wan Nur Azrina and O., Shahrul Azmir (2019) The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg. Materials Science and Engineering Technology, 50 (3). pp. 295-301. ISSN 0933-5137

M.A., Rabiatul Adawiyah and O., Saliza Azlina (2018) Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints. Journal of Alloys and Compounds, 740. pp. 958-966. ISSN 0925-8388

M.A., Rabiatul Adawiyah and O., Saliza Azlina (2017) Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper. Materials Science & Engineering Technology, 48 (3-4). pp. 235-240. ISSN 0933-5137